Backstop device
Device configuration for unwinding, applying backstop coating, drying, and winding! Backstop device with a transport speed of 1.5m to 2.0m.
We would like to introduce our "Backstop Device" that coats the backside of TAB device holes with resist. The transport speed is 1.5m to 2.0m/min, and the material thickness is from PI 25μm. The device consists of unwinding, backstop coating, drying, and winding processes. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material width: For TAB/CSP/COF, 35mm to 160mm (none for FPC) ■ Processing surface: One side ■ Utility: Power supply AC 200V・220V / 50Hz・60Hz, heat exhaust ■ Device dimensions: 24mL × 1mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
